Ltcc Ceramic Package

These fabrication technologies provide unique solutions for high interconnect density compact networks and high.

Ltcc ceramic package.

Ausn eutectic process steps. Schott is also able to supply low temperature cofired ceramic ltcc housings through its partnership with via electronic. 2 3 low cost multilayer ceramic package for flip chip mmic up to w band. Hermetic multilayer ceramic packages and substrates are ideal for more complex packaging solutions such as micro electronic mechanical systems mems and high frequency applications because such packages are hermetic and.

Ceramic packages for automotive electronics. Ltcc also features the ability to embed passive elements such as resistors capacitors and inductors into the ceramic package minimising the size of the completed module. Ltcc substrate with embedded passive components. High lead count packages.

Ceramic packages and optical filters for image sensors. It is sometimes referred to as glass ceramics because its composition consists of glass and aluminum. Package types multilayer technology provides 3 dimensional design flexibility for high performance requirements ceramic to metal htcc technology provides design freedom for ceramic feedthroughs in metal housings circular and rectangular the limitless design configurations provide the highest density hermetic packaging solutions available. Kyocera s ltcc hard materials have a high flexural strength 400mpa that is equivalent to alumina ceramics.

Neo tech has emerged as north america s leading manufacturer of quality low temperature co fired ceramic ltcc and high temperature co fired htcc substrates and packages. High strength materials ltcc hard. Ceramic packages for mems sensors. The multilayer ceramic is co fired at high temperatures to form a solid and hermetic ceramic.

Optical packages htcc is a practical choice or optical applications packages due to hermeticity flatness capability and stable over a wide temperature range. Ltcc low temperature co fire ceramics is a multi layer glass ceramic substrate which is co fired with low resistance metal conductors at low firing temperature less than 1000. Components for fiber optic connectors. Our custom made ceramic leadless chip carriers are suited for applications that warrant a surface mounted low profile package having low inductance.

For htcc a final metal coating e g. High reliability ceramic substrates ltcc htcc. Ceramic packages for power electronics. A low cost multilayer low temperature co fired ceramic ltcc package based on a mass production design rule for an mmic up to w band has been developed.

A plated ni or ni au coating on the accessible metal structures offers the possibility for high temperature brazing using e g. Htcc components generally consist of multilayers of alumina or zirconia with platinum tungsten and molymanganese metalization. The package structure includes a cavity for the flip chip mmic and improved coplanar feed through to suppress radiation. Ceramic packages for light emitting diodes leds ltcc packages for rf modules.